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TSA1203
Dual-channel 12-bit 40Msps 215mW A/D converter
Features

Low power consumption: 215 mW@40 Msps Single supply voltage: 2.5 V Independent supply for CMOS output stage with 2.5 V/3.3 V capability SFDR = -75 dBc @ Fin = 10 MHz 1GHz analog bandwidth track-and-hold Common clocking between channels Dual simultaneous sample and hold inputs Multiplexed binary word outputs Built-in reference voltage with external bias capability
index corner
7x7mm TQFP48
GNDBE D0(LSB) VCCBE REFPI VCCBI REFMI VCCBI CLKD INCMI AVCC AVCC OEB
48 47 46 45 AGND 1 INI 2
44 43 42
41 40 39 38 37 36 D2 35 D3 34 D4 33 D5 32 D6 31 D7
D1
AGND 3 INIB 4 AGND 5 IPOL 6 AVCCB 7 AGND 8 INQ 9 AGND 10
TSA1203
30 D8 29 D9 28 D10 27 D11(MSB) 26 VCCBE 25 GNDBE
Description
The TSA1203 is a new generation high-speed, dual-channel analog-to-digital converter implemented in a mainstream 0.25 m CMOS technology that offers high performance and very low power consumption. The TSA1203 is specifically designed for applications requiring a very low noise floor, high SFDR and good insulation between channels. It is based on a pipeline structure and digital error correction to provide high static linearity at FS = 40 Msps, and Fin = 10 MHz. Each channel has an integrated voltage reference to simplify the design and minimize external components. It is nevertheless possible to use the circuit with external references. The ADC binary word outputs are multiplexed in a common bus with a small number of pins. A tri-state capability is available for the outputs, allowing chip selection. The inputs of the ADC must be differentially driven. The TSA1203 is available in extended temperature range (-40 C to +85 C), in a small 48-pin TQFP package.
INBQ 11 AGND 12 13 REFPQ 14 15 16 REFMQ INCMQ AGND 17 18 19 20 21 22 AVCC DVCC DGND CLK SELECT DGND 23 24 DVCC GNDBI
Applications

Medical imaging and ultrasound 3G base station I/Q signal processing applications High-speed data acquisition systems Portable instrumentation
December 2006
Rev 4
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www.st.com 30
Contents
TSA1203
Contents
1 2 3 4 5 6 7 8 Schematic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8.1 Additional functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8.1.1 8.1.2 Output enable mode (OEB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Select mode (SELECT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8.2
References and common mode connection . . . . . . . . . . . . . . . . . . . . . . . 16
8.2.1 8.2.2 Internal reference and common mode . . . . . . . . . . . . . . . . . . . . . . . . . . 16 External reference and common mode . . . . . . . . . . . . . . . . . . . . . . . . . 16
8.3 8.4 8.5 8.6 8.7
Driving the differential analog inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Clock input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Layout precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 EVAL1203/BA evaluation board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8.7.1 8.7.2 8.7.3 8.7.4 Evaluation board operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Consumption adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Single and differential inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
9
Practical application examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
9.1 9.2 Digital interface applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Medical imaging applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
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TSA1203
Contents
10
Definitions of specified parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Static parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Dynamic parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
11
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
11.1 TQFP48 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
12 13
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
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Schematic diagram
TSA1203
1
Schematic diagram
Figure 1. TSA1203 block diagram
+2.5V/3.3V
CLK
SELECT OEB
VCCBE
Timing
VINI VINBI VINCMI VREFPI VREFMI IPOL VREFPQ VREFMQ VINCMQ VINQ VINBQ Polar.
REF Q
AD 12 I channel
12
common mode
REF I
M U X
12
12
Buffers
D0 TO D11
common mode AD 12 Q channel 12
GND
GNDBE
Figure 2.
Timing diagram
N+4 N+3 N+5 N+6 N+12 N+13
Simultaneous sampling on I/Q channels
I N+2 N-1 N Q N+1
N+7 N+8 N+9 N+10
N+11
CLK
Tpd I + Tod Tod
SELECT
CLOCK AND SELECT CONNECTED TOGETHER
OEB
sample N-8 I channel
sample N-6 Q channel
sample N Q channel
sample N+1 Q channel
sample N+2 Q channel
DATA OUTPUT sample N-9 I channel
sample N-7 Q channel
sample N+1 sample N+2 I channel I channel
sample N+3 I channel
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TSA1203
Pin descriptions
2
Table 1.
Pin nb 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Pin descriptions
Pin descriptions (TQFP48 package)
Name AGND INI AGND INBI AGND IPOL AVCC AGND INQ AGND INBQ AGND REFPQ Description Analog ground I channel analog input Analog ground I channel inverted analog input Analog ground Analog bias current input Analog power supply Analog ground Q channel analog input Analog ground Q channel inverted analog input Analog ground 0V 0V 2.5 V 0V 0V Observation 0V Pin nb 25 26 0V 27 28 29 30 31 32 33 34 35 36 37 0V 38 39 0V 2.5 V 2.5 V 0V 2.5 V CMOS input 2.5 V CMOS input 0V 2.5 V 0V 40 41 42 43 44 45 46 47 48 Name GNDBE Description Observation 0V 2.5 V/3.3 V CMOS output (2.5 V/3.3 V) CMOS output (2.5 V/3.3 V) CMOS output (2.5 V/3.3 V) CMOS output (2.5 V/3.3 V) CMOS output (2.5 V/3.3 V) CMOS output (2.5 V/3.3 V) CMOS output (2.5 V/3.3 V) CMOS output (2.5 V/3.3 V) CMOS output (2.5 V/3.3 V) CMOS output (2.5 V/3.3 V) CMOS output (2.5 V/3.3 V) CMOS output (2.5 V/3.3 V) 2.5 V/3.3 V - see Table 14. 0V 2.5 V Idle at high level 2.5 V or 3.3 V 2.5 V/3.3 V CMOS input 2.5 V 2.5 V
Digital buffer ground Digital buffer power VCCBE supply D11(MS Most significant bit B) output D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0(LSB) VCCBE GNDBE VCCBI CLKD OEB AVCC AVCC INCMI REFMI REFPI Digital output Digital output Digital output Digital output Digital output Digital output Digital output Digital output Digital output Digital output Least significant bit output Digital buffer power supply Digital buffer ground Digital buffer power supply Data clock input Output enable input Analog power supply Analog power supply I channel input common mode I channel bottom reference voltage I channel top reference voltage
Q channel top reference voltage Q channel bottom REFMQ reference voltage Q channel input INCMQ common mode AGND Analog ground AVCC DVCC DGND CLK Analog power supply Digital power supply Digital ground Clock input
SELECT Channel selection DGND DVCC GNDBI Digital ground Digital power supply Digital buffer ground
0V
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Dynamic characteristics
TSA1203
3
Dynamic characteristics
Dynamic characteristics are measured under the following conditions, unless otherwise specified: AVCC = DVCC = VCCB = 2.5 V, FS = 40 Msps, Fin=10.13 MHz, Vin@ -1 dBFS, VREFP=0.8 V, VREFM=0 V, Tamb = 25 C. Table 2.
Symbol SFDR SNR THD SINAD ENOB
Dynamic characteristics
Parameter Spurious free dynamic range Signal to noise ratio Total harmonics distortion Signal to noise and distortion ratio Effective number of bits 56.5 9.1 60.7 Min Typ -75 67 -73 66 10.8 -58 Max -59.5 Unit dBc dB dBc dB bits
4
Timing characteristics
Timing characteristics are measured under the following conditions, unless otherwise specified: AVCC = DVCC = VCCB = 2.5 V, FS = 40 Msps, Fin=10.13 MHz, Vin@ -1 dBFS, VREFP=0.8 V, VREFM=0 V, Tamb = 25 C. Table 3.
Symbol FS DC TC1 TC2 Tod Tpd I Tpd Q Ton Toff
Timing characteristics
Parameter Sampling frequency Clock duty cycle Clock pulse width (high) Clock pulse width (low) Data output delay (clock edge to data valid) Data pipeline delay for I channel Data pipeline delay for Q channel Falling edge of OEB to digital output valid data Rising edge of OEB to digital output tristate 10 pF load capacitance Test conditions Min 0.5 45 22.5 22.5 50 25 25 9 7 7.5 1 1 Typ Max 40 55 Unit MHz % ns ns ns cycles cycles ns ns
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TSA1203
Absolute maximum ratings
5
Absolute maximum ratings
Table 4.
Symbol AVCC DVCC VCCBE VCCBI IDout Tstg ESD Latch-up
Absolute maximum ratings
Parameter Analog supply voltage (1) Digital supply voltage
(1) (1)
Values 0 to 3.3 0 to 3.3 0 to 3.6 0 to 3.3 -100 to 100 -65 to +150 2
Unit V V V V mA C kV
Digital buffer supply voltage
Digital buffer supply voltage (1) Digital output current Storage temperature HBM: human body model(2)
CDM: charged device model(3) Class(4)
1.5 A
1. All voltage values, except differential voltage, are with respect to network ground terminal. The magnitude of input and output voltages must not exceed -0.3 V or VCC. 2. Electrostatic discharge pulse (ESD pulse) simulating a human body discharge of 100 pF through 1.5 k.. 3. Discharge to ground of a device that has been previously charged. 4. ST Microelectronics corporate procedure number 0018695.
6
Operating conditions
Table 5.
Symbol AVCC DVCC VCCBE VCCBI VREFP I VREFP Q VREFM I VREFM Q VINCM I VINCM Q
Operating conditions
Parameter Analog supply voltage Digital supply voltage External digital buffer supply voltage Internal digital buffer supply voltage Forced top voltage reference Forced bottom reference voltage Forced input common mode voltage Min 2.25 2.25 2.25 2.25 0.94 0 0.2 Typ 2.5 2.5 2.5 2.5 Max 2.7 2.7 3.5 2.7 1.5 0.4 1 Unit V V V V V V V
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Electrical characteristics
TSA1203
7
Electrical characteristics
Electrical characteristics, unless otherwise specified, are measured at AVCC = DVCC = VCCB = 2.5 V, FS = 40 Msps, Rpol = 18 k Fin = 2 MHz, Vin@ -1 dBFS, , VREFP=0.8 V, VREFM=0 V, and Tamb = 25 C. Table 6.
Symbol
Analog inputs
Parameter Test conditions Differential inputs mandatory Min Typ Max Unit
VIN-VINB Full scale reference voltage Cin Req BW ERB Input capacitance Equivalent input resistor Analog input bandwidth Effective resolution bandwidth
1.1
2.0 7.0 10
2.8
Vpp pF k MHz MHz
Vin@full scale, Fs=40 Msps
1000 70
Table 7.
Symbol
Digital inputs and outputs
Parameter Test conditions Min Typ Max Unit
Clock and Select inputs VIL VIH Logic "0" voltage Logic "1" voltage 2.0 0 2.5 0.8 V V
OEB input VIL VIH Logic "0" voltage Logic "1" voltage 0.75 x VCCBE 0 VCCBE 0.25 x VCCBE V V
Digital outputs VOL VOH IOZ CL Logic "0" voltage Logic "1" voltage High impedance leakage current Output load capacitance IOL=10 A IOH=10 A OEB set to VIH 0.9 x VCCBE -1.67 0 VCCBE 0 1.67 15 0.1 x VCCBE V V A pF
Table 8.
Reference voltage
Parameter Top internal reference voltage Input common mode voltage Min 0.81 0.41 Typ 0.88 0.46 Max 0.94 0.50 Unit V V
Symbol VREFP I VREFP Q VINCM I VINCM Q
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TSA1203 Table 9.
Symbol ICCA ICCD ICCBE ICCBI Pd Rthja
Electrical characteristics Power consumption
Parameter Analog supply current Digital supply current Digital buffer supply current (10 pF load) Digital buffer supply current Power consumption in normal operation mode Thermal resistance (TQFP48) Min Typ 76 3.5 6 100 215 80 Max 96.5 4.9 9.4 440 271 Unit mA mA mA A mW C/W
Table 10.
Symbol OE GE DNL INL -
Accuracy
Parameter Offset error Gain error Differential non linearity Integral non linearity Monotonicity and no missing codes Min Typ 2.97 0.1 0.52 3 Guaranteed Max Unit LSB % LSB LSB
Table 11.
Symbol GM OM PHM XTLK
Matching between channels
Parameter Gain match Offset match Phase match Crosstalk rejection Min Typ 0.04 0.88 1 85 Max 1 Unit % LSB dg dB
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Electrical characteristics Figure 3.
2.5 2 1.5
TSA1203
Static parameter: integral non linearity(a) FS = 40 Msps, ICCA = 60 mA, Fin = 2 MHz
INL (LSBs)
1 0.5 0 -0.5 -1 -1.5 -2 -2.5 0 500 1000 1500 2000 2500 3000 3500 4000
Output Code
Figure 4.
0.6 0.4
Static parameter: differential non linearity(a) Fs = 40 Msps, ICCA = 60 mA, Fin = 2 MH
DNL (LSBs)
0.2 0 -0.2 -0.4 -0.6 0 500 1000 1500 2000 2500 3000 3500 4000
Output Code
a. For parameter definitions, see Section 10: Definitions of specified parameters on page 25.
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TSA1203
Electrical characteristics
Figure 5.
Linearity vs. FS Fin = 5MHz
12
ENOB_I ENOB_Q
Figure 6.
Distortion vs. FS Fin = 5MHz
80
-40
11.5 11 10.5 ENOB (bits)
Dynamic parameters (dBc)
Dynamic parameters (dB)
75
-50 -60 -70 -80 -90 -100 35 40 45 50
THD_I SFDR_I SFDR_Q THD_Q
70
SNR_I SNR_Q
10 9.5 9 8.5
65
60
SINAD_I
SINAD_Q
8 7.5
55 35 40 45 50
7
Fs (MHz)
Fs (MHz)
Figure 7.
Linearity vs. Fin FS= 40MHz, ICCA = 60mA
12
ENOB_Q
Figure 8.
-40
Distortion vs. Fin FS= 40MHz, ICCA = 60mA
Dynamic parameters (dB)
85 80 75 70 65 60
SINAD_I
Dynamic parameters (dBc)
90
11
-50 -60 -70 -80
THD_I SFDR_I THD_Q SFDR_Q
10
SNR_Q
SNR_I
ENOB_I
9 8
55 50 0
SINAD_Q
7 6
ENOB (bits)
-90 -100 0 20 40 60 80
20
40
60
80
Fin (MHz)
Fin (MHz)
Figure 9.
Linearity vs. temperature FS=40MHz, ICCA=60mA, Fin=2MHz
12
ENOB_I
Figure 10. Distortion vs. temperature FS=40Msps, ICCA=60mA, Fin=2MHz
100
90
Dynamic parameters (dB)
Dynamic parameters (dBc)
85 80
ENOB_Q
11 10 9
SINAD_I SNR_I
95 90 85 80 75 70 65 60 55 50 -40 10 60 110
THD_I SFDR_I SFDR_Q THD_Q
75 70 65 60 55 50 -40 10 60
SNR_Q SINAD_Q
8 7 6 5 4 110
Temperature (C)
ENOB (bits)
Temperature (C)
11/30
Electrical characteristics
TSA1203
Figure 11. Linearity vs. AVCC Figure 12. Distortion vs. AVCC FS=40Msps, ICCA=60mA, Fin=10MHz FS=40Msps, ICCA=60mA, Fin=10MHz
Dynamic parameters (dB) Dynamic Parameters (dBc)
70 68 66 64 62 60 58 56 54 52 50 2.25 9 2.35 2.45 2.55 2.65 10
ENOB_I ENOB_Q SINAD_I SNR_I
12 11.5
SNR_Q SINAD_Q
-50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 2.25
THD_Q THD_I SFDR_Q SFDR_I
11 10.5
9.5
ENOB (bits)
2.35
2.45
2.55
2.65
AVCC (V)
AVCC (V)
Figure 13. Linearity vs. DVCC Figure 14. Distortion vs. DVCC FS=40Msps, ICCA=60mA, Fin=10MHz FS=40Msps, ICCA=60mA, Fin=10MHz
Dynamic parameters (dB) Dynamic Parameters (dBc)
70 68 66 64 62 60 58 56 54 52 50 2.25 9 2.35 2.45 2.55 2.65 10
ENOB_I ENOB_Q SINAD_I SNR_I
12 11.5
SNR_Q SINAD_Q
-50 -55 -60 -65 -70 -75 -80 -85 -90 2.25
THD_I THD_Q SFDR_I SFDR_Q
11 10.5
9.5
ENOB (bits)
2.35
2.45
2.55
2.65
DVCC (V)
DVCC (V)
Figure 15. Linearity vs. VCCBI Figure 16. Distortion vs.VCCBI FS=40Msps, ICCA=60mA, Fin=10MHz FS=40Msps, ICCA=60mA, Fin=10MHz
Dynamic parameters (dB) Dynamic Parameters (dBc)
70 68 66 64 62 60 58 56 54 52 50 2.25 9 2.35 2.45 2.55 2.65 10
ENOB_I ENOB_Q SINAD_I SNR_I
12 11.5
SNR_Q SINAD_Q
-50 -55 -60 -65 -70 -75 -80 -85 -90 2.25
THD_I THD_Q SFDR_I SFDR_Q
11 10.5
9.5
ENOB (bits)
2.35
2.45
2.55
2.65
VCCBI (V)
VCCBI (V)
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TSA1203
Electrical characteristics
Figure 17. Linearity vs. VCCBE FS=40Msps, ICCA=60mA, Fin=5MHz
70 12 11.5
ENOB_I ENOB_Q
Figure 18. Distortion vs. VCCBE FS=40Msps, ICCA=60mA, Fin=5MHz
Dynamic Parameters (dBc)
-40 -50 -60 -70 -80 -90 -100 -110 2.25
THD_I THD_Q SFDR_Q SFDR_I
Dynamic parameters (dB)
69 68 67 66 65 64 63 62 61 60 2.25 2.75 3.25
SINAD_Q SINAD_I SNR_Q SNR_I
11 10.5 10 9.5 9 8.5 8
ENOB (bits)
2.75
3.25
VCCBE (V)
VCCBE (V)
Figure 19. Linearity vs. duty cycle FS=40MHz, ICCA=60mA, Fin=5MHz
100 12
ENOB_I
Figure 20. Distortion vs. duty cycle FS=40MHz, ICCA=60mA, Fin=5MHz
-40
90 80
ENOB_Q
11 10
Dynamic parameters (dBc)
Dynamic parameters (dB)
-50
SFDR_Q THD_Q
ENOB (bits)
9 8 7
-60 -70 -80 -90 -100 48 49 50 51 52
THD_I SFDR_I
70 60
SNR_I SINAD_I
SNR_Q
6 5 4
50 40 48
SINAD_Q
49
50
51
52
Positive Duty Cycle (%)
Positive Duty Cycle (%)
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Electrical characteristics Figure 21. Single-tone 8K FFT at 40 Msps - Channel Q Fin = 5MHz, ICCA = 60mA, Vin@-1dBFS
0
TSA1203
Power spectrum (dB)
-20 -40 -60 -80 -100 -120 -140 2 4 6 8 10 12 14 16 18 20
Frequency (MHz)
Figure 22. Dual-tone 8K FFT at 40Msps - Channel Q Fin1 = 0.93MHz, Fin2 = 1.11MHz, ICCA = 70mA, Vin1@-7dBFS, Vin2@-7dBFS, IMD = -69dBc
0
Power spectrum (dB)
-20 -40 -60 -80
-100 -120 2.5 5 7.5 10 12.5 15 17.5 20
Frequency (MHz)
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TSA1203
Application information
8
Application information
The TSA1203 is a dual-channel, 12-bit resolution high speed analog-to-digital converter based on a pipeline structure and deep sub-micron CMOS process to achieve the best performance in terms of linearity and power consumption. Each channel achieves 12-bit resolution through the pipeline structure which consists of 12 internal conversion stages in which the analog signal is fed and sequentially converted into digital data. A latency time of 7 clock periods is necessary to obtain the digitized data on the output bus. The input signals are simultaneously sampled, for both channels, on the rising edge of the clock. The output data is delivered on the rising edge of the clock for channel I, and on the falling edge of the clock for channel Q, as shown in Figure 2: Timing diagram on page 4. The digital data produced at the various stages must be time-delayed according to the order of conversion. Finally, a digital data correction completes the processing and ensures the validity of the ending codes on the output bus. The TSA1203 is pin-to-pin compatible with the dual 10 bits/20 Msps TSA1005-20, the dual 10 bits /40 Msps TSA1005-40 and the dual 12 bits/ 20 Msps TSA1204.
8.1
Additional functions
To simplify the application board as much as possible, the following operating modes are provided:

Output enable (OEB) mode Select mode
8.1.1
Output enable mode (OEB)
When set to low level (VIL), all digital outputs remain active and are in low impedance state. When set to high level (VIH), all digital output buffers are in high impedance state while the converter goes on sampling. When OEB is set to a low level again, the data arrives on the output with a very short Ton delay. This mechanism allows the chip select of the device. Figure 2: Timing diagram on page 4 summarizes this functionality. If you do not want to use OEB mode, the OEB pin should be grounded through a low value resistor.
8.1.2
Select mode (SELECT)
The digital data output from each of the ADC cores is multiplexed to share the same output bus. This prevents an increase in the number of pins and allows to use the same package as for a single-channel ADC like the TSA1201. The information channel is selected with the "SELECT" pin. When set to high level (VIH), the channel I data is present on the D0-D11 output bus. When set to low level (VIL), the channel Q data is delivered on D0-D11. By connecting SELECT to CLK, channel I and channel Q are simultaneously present on D0D11, channel I on the rising edge of the clock and channel Q on the falling edge of the clock. (refer to Figure 2: Timing diagram on page 4).
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Application information
TSA1203
8.2
References and common mode connection
VREFM must always be connected directly to ground externally for most applications.
8.2.1
Internal reference and common mode
In the default configuration, the ADC operates with its own reference and common mode voltages generated by its internal bandgap. It is recommended to decouple the VREFP and INCM pins in order to minimize low and high frequency noise (see Figure 23). Figure 23. Internal reference and common mode setting
0.89V VIN VREFP
0.46V
330pF 10nF 4.7F
330pF 10nF 4.7F
TSA1203
VINB INCM VREFM
8.2.2
External reference and common mode
Each of the voltages VREFP, VREFM and INCM can be fixed externally to better fit the application needs (refer to Table 5: Operating conditions on page 7 for min/max values). It is possible to use an external reference voltage device for specific applications requiring even better linearity, accuracy or enhanced temperature behavior. The VREFP and VREFM voltages set the analog dynamic range at the input of the converter that has a full scale amplitude of 2*(VREFP-VREFM). The INCM voltage is half the value of VREFP-VREFM. The best signal-to-noise performance is achieved with a dynamic range at its maximum value. To obtain this, VREFM can be connected to GND, and VREFP can be set up to 1.5 V maximum. However, signal to noise performance is a trade-off with the THD, with a possibility of degraded THD under these conditions. To obtain the highest performance from the TSA1203 device, we recommend implementing the configuration shown in Figure 24 with the STMicroelectronics TS821 or TS4041-1.2 Vref.
16/30
TSA1203 Figure 24. External reference setting
1k VCCA VREFP VIN 1.2V
330pF 10nF 4.7F
Application information
TSA1203
VINB VREFM
TS821 TS4041 external reference
8.3
Driving the differential analog inputs
The TSA1203 is designed to deliver optimum performance when driven on differential inputs. An RF transformer is an efficient way of achieving this high performance. Figure 25 describes the schematics. The input signal is fed to the primary of the transformer, while the secondary drives both ADC inputs. The common mode voltage of the ADC (INCM) is connected to the center-tap of the secondary of the transformer in order to bias the input signal around this common voltage, internally set to 0.46V. It determines the DC component of the analog signal. Being a high-impedance input, it acts as an I/O and can be externally driven to adjust this DC component. The INCM is decoupled to maintain a low noise level on this node. Our evaluation board is mounted with a 1:1 ADT1-1WT transformer from Mini circuits. You might also use a higher impedance ratio (1:2 or 1:4) to reduce the driving requirement on the analog source. Each analog input can drive a 1.4 Vpp amplitude input signal, so the resulting differential amplitude is 2.8 Vpp. Figure 25. Differential input configuration with transformer
Analog source
ADT1-1 1:1
33pF
50
TSA1203 channels VINB I or Q
INCM
VIN
330pF
10nF
470nF
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Application information Figure 26. AC-coupled differential input
VIN
100k 33pF common mode 10nF 100k
TSA1203
50
10nF
INCM
TSA1203
VINB
50
Figure 26 represents the biasing of a differential input signal in an AC-coupled differential input configuration. Both inputs VIN and VINB are centered around the common mode voltage, which can be left internal, or fixed externally. Figure 27. DC-coupled 2 Vpp differential analog input
analog DC analog DC
AC+DC
VIN
VREFP
TSA1203
VINB
VREFM
INCM
VREFP-VREFM = 1 V
330pF
10nF
4.7F
VINCM = 0.5 V
Figure 27 shows a DC-coupled configuration with forced VREFP and INCM to the 1V DC analog input while VREFM is connected to ground; the differential amplitude obtained is 2 Vpp.
8.4
Clock input
The quality of your TSA1203 converter is very dependent on your clock input accuracy, in terms of aperture jitter; the use of a low jitter crystal controlled oscillator is recommended. Further points to consider in your implementation are:

The duty cycle must be between 45% and 55%. The clock power supplies must be independent from the ADC output supplies to avoid digital noise modulation on the output. When powered-on, the circuit needs several clock periods to reach its normal operating conditions. Therefore, it is recommended to keep the circuit clocked to avoid random states before applying the supply voltages.
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TSA1203
Application information
8.5
Power consumption optimization
The internal architecture of the TSA1203 makes it possible to optimize power consumption according to the sampling frequency of the application. For this purpose, an external resistor is placed between IPOL and the analog ground pins. Therefore, the total dissipation can be optimized over the full sampling range (0.5 Msps to 40 Msps). The TSA1203 combines the highest performance with the lowest consumption at 40 Msps when Rpol is equal to 18 k. This value is nevertheless dependent on the application and the environment. In the lower sampling frequency range, this value of resistor may be adjusted in order to decrease the analog current without any degradation of dynamic performance. Table 12 gives some values to illustrate this. Table 12.
FS (Msps) Rpol (k) Optimized power (mW)
Total power consumption optimization depending on Rpol value
30 38 145 35 28 180 40 18 215
8.6
Layout precautions
To use the ADC circuits most efficiently at high frequencies, some precautions have to be taken for power supplies:
The implementation of 4 proper separate supplies and ground planes (analog, digital, internal and external buffer ones) on the PCB is mandatory for high speed circuit applications to provide low inductance and low resistance common return. The separation of the analog signal from the digital output part is essential to prevent noise from coupling onto the input signal. The best compromise is to connect AGND, DGND, GNDBI in a common point whereas GNDBE must be isolated. Similarly, the AVCC, DVCC and VCCBI power supplies must be separate from the VCCBE power supply.

Power supply bypass capacitors must be placed as close as possible to the IC pins in order to improve high frequency bypassing and reduce harmonic distortion. All inputs and outputs must be properly terminated with output termination resistors; thus, the amplifier load is resistive only and the stability of the amplifier is improved. All leads must be wide and as short as possible especially for the analog input in order to decrease parasitic capacitance and inductance. To keep the capacitive loading as low as possible at digital outputs, short lead lengths of routing are essential to minimize currents when the output changes. To minimize this output capacitance, use buffers or latches close to the output pins. Choose component sizes as small as possible (SMD).
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Application information
TSA1203
8.7
EVAL1203/BA evaluation board
The EVAL1203/BA is a 4-layer board with high decoupling and grounding level. The schematic of the board is shown in Figure 30 and its top overlay view in Figure 29. The board has been characterized with a fully devoted ADC test bench as shown in Figure 28. All characterization measurements are made with:

SFSR=1 dB for static parameters, SFSR=-1 dB for dynamic parameters.
Figure 28. Analog to digital converter characterization bench
HP8644 Sine Wave Generator Vin ADC evaluation board Clk HP8133 Pulse Generator Data Logic Analyzer Clk PC
HP8644
Sine Wave Generator
Note:
The analog input signal must be filtered to be very pure. The dataready signal is the acquisition clock of the logic analyzer. The ADC digital outputs are latched by the octal buffers 74LCX573. Figure 29. Evaluation board printed circuit
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TSA1203
REFP REFM INCM
JI2 VREFI VCCB1 VCCB2 VCCB3 VCCB1 VCCB2 Switch S4 Open Short OEB Mode Normal mode High Impedance output mode R12 S4 SW-SPST R11 R23 47K STG719 VCCB1 C44 47F
+
GndB1 VccB1 GndB2 VccB2 GndB3 VccB3
NM: non soude
J17 BUFPOW analog input with transformer (default) single input differential input
RS5 RS6 RS7 RS8 RS9 CCC C C C C
47K S5 SW-SPST U1 CON2 VCCB2 Switch S5 Open Short Normal mode Test mode 2 1 R5 50
J26
J25 CKDATA
R21 0NM 0NM
R22
R24
0NM
0NM
IN S2 Vcc D GNDS1
C28 VCCB2 C16 470nF AVCC C53 470nF C34 47F VCCB3
+
C43 10F J6 470nF C27 C37 C39 C51 330pF 10nF 330pF 470nF DO D1 D2 D3 D4 D5 D6 74LCX573 D7 D8 D9 D10 D11 CLK 74LCX573 C38 C18 10nF C40 CD3 330pF C19 470nF C33 C35
+
RSI5 C15 10nF C14 330pF C52 10nF
RSI6 1 10nF C25 330pF C26 CI13 470nF 10nF 470nF 10nF 48 47 46 45 44 43 42 41 40 39 38 37 330pF 330pF 470nF 10nF 330pF CI12 CI11
0 NC TI2 6
RSI7
0
2 CI10 CI9 CI8 CI32 CI31 CI30
0
RI1 50
D0 GND D1 GND D2 GND D3 GND D4 GND D5 GND D6 GND D7 GND D8 GND D9 GND D10 GND D11 GND CLK GND
3
4 RSI8 T2-AT1-1WT0
JI1B InIB J9 CI1 33pF NM R2 C41
+
RSI9
RI19 50 REFPI REFMI INCMI AVCC AVCC OEB CLKD VCCBI VCCBI GNDBE VCCBE D0(LSB) D1 CI6
0 NC
1 2 3 4 5 6 7 8 9 10 OEB VCC D0 Q0 D1 Q1 D2 Q2 D3 Q3 D4 Q4 U2 D5 Q5 D6 Q6 D7 Q7 GND LE
20 19 18 17 16 15 14 13 12 11
AVCC C3 Raj1 47K ADC DUAL12B REFPQ REFMQ INCMQ AGND AVCC DVCC DGND CLK SELECT DGND DVCC GNDBI 470nF 10nF 330pF C4 C2 1K 8-14bits ADC C42 47F10F
JA
VCC GND
Figure 30. TSA1203 evaluation board schematic
ANALOGIC
1 2 3 4 5 6 7 8 9 10 11 12 AGND INI AGND INBI AGND IPOL AVCC AGND INQ AGND INBQ AGND D2 D3 D4 D5 D6 D7 D8 D9 D10 D11(MSB) VCCBE GNDBE
36 35 34 33 32 31 30 29 28 27 26 25
RSQ5 CQ1 13 14 15 16 17 18 19 20 21 22 23 24 C29 10F
+
1 Q 33pF DVcc C17 330pF CQ13 CQ12 CQ11 CD1 470nF CD2 10nF CQ10 CQ9 470nF 10nF 470nF 10nF 330pF 470nF 10nF 330pF 330pF CQ8 CQ32 CQ31 CQ30 NM
RQ1 50
RSQ61 0
0 NC RSQ7 TQ2 6 0 2
CQ6
1 2 3 4 5 6 7 8 9 10
OEB VCC D0 Q0 D1 Q1 U3 D2 Q2 D3 Q3 D4 Q4 D5 Q5 D6 Q6 D7 Q7 GND LE
20 19 18 17 16 15 14 13 12 11
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
3
4 RSQ8 T2-AT1-1WT 0
470nF 10nF 330pF 47F VCCB2
JQ1B InQB
RSQ9
RQ19 50 C20 330pF SW1 C10 330pF C21 10nF DVCC C11 10nF J27 2 1 CON2 C31 10F C36 47F C32 47F
+ +
0 NC
C22 470nF C23 10F REFP REFM INCM JQ2 VREFQ AVCC C13 470nF
DVCC
C5 100nF J4 50 CLK R3
VCC GND
DIGITAL JD
Application information
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Application information Table 13.
Name Part Type RSQ6 0 RSQ7 0 RSQ8 0 RSI6 0 RSI7 0 RSI8 0 47 R3 47 R5 RQ19 47 47 RI1 RQ1 47 RI19 47 RSI9 0NC RSQ5 0NC RSQ9 0NC RSI5 0NC 0NC R24 0NC R23 0NC R21 0NC R22 1K R2 47K R12 47K R11 Raj1 200K C23 C41 C29
TSA1203
Printed circuit board -- list of components
Footprint 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 603 Name Part Type C26 330pF C20 330pF C33 330pF C25 330pF CI1 33pF CQ1 33pF C34 47F C42 47F C35 47F C44 47F C36 47F C32 47F C37 470nF CQ10 470nF C28 470nF CI10 470nF CQ32 470nF CQ13 470nF CI32 470nF C13 470nF C53 470nF C16 470nF C3 470nF C22 470nF CI13 470nF C38 470nF CD1 470nF C19 470nF Footprint Name Part Footprint Type 603 CQ6 NC 805 603 CI6 NC 805 603 U2 74LCX573 TSSOP20 603 U3 74LCX573 TSSOP20 603 U1 STG719 SOT23-6 603 JA ANALOGIC connector RB.1 J17 BUFPOW connector RB.1 J25 CKDATA SMA RB.1 J4 CLK SMA RB.1 J27 CON2 SIP2 RB.1 J26 CON2 SIP2 RB.1 JD DIGITAL connector 805 JI1 InI SMA 805 JI1B InIB SMA 805 JQ1 InQ SMA 805 JQ1B InQB SMA 805 SW1 SWITCH connector 805 S5 SW-SPST connector 805 S4 SW-SPST connector 805 TI2 T2-AT1-1WT ADT 805 TQ2 T2-AT1-1WT ADT 805 JI2 VREFI connector 805 JQ2 VREFQ connector 805 J6 32Pin IDC-32 805 connector 805 805 NC: non soldered 805
Footprint Name Part Type 805 CD2 10nF 805 C40 10nF 805 C39 10nF 805 CQ12 10nF 805 CQ9 10nF 805 C52 10nF 603 C18 10nF 603 C21 10nF 603 C4 10nF 603 C15 10nF 603 C27 10nF 603 C11 10nF 805 CI9 10nF 805 CI12 10nF 805 CI31 10nF 805 CQ31 10nF 805 CQ30 330pF 805 CI11 330pF 805 C51 330pF 805 C2 330pF 603 C17 330pF 603 CD3 330pF 603 C10 330pF CQ8 330pF VR5 CQ11 330pF trimmer 10F 1210 CI8 330pF 10F 1210 C14 330pF 10F 1210 CI30 330pF
8.7.1
Evaluation board operating conditions
Table 14. Board connections for power supplies and other pins
Connection AVCC AGND REFPI REFMI INCMI REFPQ REFMQ INCMQ DVCC DGND GNDBI VCCBI GNDBE 0.46 0.46 0.89 0.89 Internal voltage (V) External voltage (V) 2.5 0 <1.4 <0.4 <1 <1.4 <0.4 <1 2.5 0 0 2.5 0
Board marking AV AG RPI RMI CMI RPQ RMQ CMQ DV DG GB1 VB1 GB2
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TSA1203 Table 14.
Application information Board connections for power supplies and other pins (continued)
Connection VCCBE GNDB3 VCCB3 Internal voltage (V) External voltage (V) 2.5/3.3 0 2.5
Board marking VB2 GB3 VB3
Caution:
Do not use the VB3 power supply (5 V) dedicated to the 74LCX573 external buffers to supply the VB2 of the TSA1203 which cannot exceed 3.3 V.
8.7.2
Consumption adjustment
Before beginning characterization tests, make sure to adjust the Rpol (Raj1), and therefore Ipol value, according to your sampling frequency.
8.7.3
Single and differential inputs
The test board can be driven on a single analog input, or on differential inputs. With a single analog input, you must use the ADT1-1WT transformer to generate a differential signal. In this configuration, the resistors RSI6, RSI7, RSI8 for channel I (respectively RSQ6, RSQ7, RSQ8 for channel Q) are connected as short-circuits whereas RSI5, RSI9 (respectively RSQ5, RSQ9 for channel Q) are open circuits. Alternatively, you can use the JI1 and JI1B differential inputs. In this case, the resistances RSI5, RSI9 for channel I (respectively RSQ5, RSQ9 for channel Q) are connected as shortcircuits whereas RSI6, RSI7, RSI8 (respectively RSQ6, RSQ7, RSQ8 for channel Q) are open circuits.
8.7.4
Mode selection
In order to select the channel you want to evaluate, you must set a jumper on the board in the relevant position for the SELECT pin (see Figure 31). The channels selected depend on the position of the jumper:

With the jumper connected to the upper connectors, channel I at the output is selected. With the jumper connected horizontally, channel Q at the output is selected. With the jumper connected to the lower connectors, both channels are selected, relative to the clock edge.
Figure 31. Mode selection
SELECT
I channel SELECT Q channel I/Q channels
CLK DGND DVCC
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Practical application examples
TSA1203
9
9.1
Practical application examples
Digital interface applications
The wide external buffer power supply range of the TSA1203 makes it a perfect choice for plugging into 2.5 V or 3.3 V low voltage DSPs or digital interfaces.
9.2
Medical imaging applications
Driven by the increasing demand for applications requiring either portability or a high degree of parallelism (or both), this product satisfies the requirements of medical imaging and telecom infrastructures. The typical system diagram in Figure 32, shows how a narrow input beam of acoustic energy is sent into a living body via the transducer, and how the energy reflected back is analyzed. Figure 32. Medical imaging application
HV TX amps
TX beam former
Mux and T/R switches
TGC amplifier
ADC
RX beam former
Processing and display
The transducer is a piezoelectric ceramic such as zirconium titanate. The whole array can reach up to 512 channels. The TX beam former, amplified by the HV TX amps, delivers up to 100 V amplitude excitation pulses with phase and amplitude shifts. The mux and T/R switch is a two way input signal transmitter/ output receiver. To compensate for skin and tissues attenuation effects, the time gain compensation (TGC) amplifier is an exponential amplifier that amplifies low voltage signals to the ADC input range. A differential output structure with low noise and very high linearity are essential factors. These applications need high speed, low power and high performance ADCs. 10-12 bit resolution is necessary to lower the quantification noise. As multiple channels are used, a dual converter is a must for room saving issues. The input signal is in the range of 2 to 20 MHz (mainly 2 to 7 MHz) and the application uses mostly a 4 over-sampling ratio for spurious free dynamic range (SFDR) optimization. The next RX beam former and processing blocks enable the analysis of the output channels versus the input beam.
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TSA1203
Definitions of specified parameters
10
Definitions of specified parameters
Static parameters
Static measurements are performed using the histograms method on a 2 MHz input signal, sampled at 50 Msps, which is high enough to fully characterize the test frequency response. The input level is +1 dBFS to saturate the signal.
Differential non linearity (DNL)
The average deviation of any output code width from the ideal code width of 1 LSB.
Integral non linearity (INL)
An ideal converter exhibits a transfer function which is a straight line from the starting code to the ending code. The INL is the deviation from this ideal line for each transition.
Dynamic parameters
Dynamic measurements are performed by spectral analysis, applied to an input sine wave of various frequencies sampled at 40 Msps. The input level is -1dBFS to measure the linear behavior of the converter. All the parameters are given without correction for the full scale amplitude performance except the calculated ENOB parameter.
Spurious free dynamic range (SFDR)
The ratio between the power of the worst spurious signal (not always an harmonic) and the amplitude of fundamental tone (signal power) over the full Nyquist band. It is expressed in dBc.
Total harmonic distortion (THD)
The ratio of the rms sum of the first five harmonic distortion components to the rms value of the fundamental line. It is expressed in dB.
Signal to noise ratio (SNR)
The ratio of the rms value of the fundamental component to the rms sum of all other spectral components in the Nyquist band (fs/ 2) excluding DC, fundamental and the first five harmonics. SNR is reported in dB.
Signal to noise and distortion ratio (SINAD)
Similar ratio as for SNR but including the harmonic distortion components in the noise figure (not DC signal). It is expressed in dB. The effective number of bits (ENOB) is easily deduced from the SINAD, using the formula: SINAD= 6.02 x ENOB + 1.76 dB. When the applied signal is not full scale (FS), but has an A0 amplitude, the SINAD expression becomes: SINAD2Ao=SINADFull Scale+ 20 log (2A0/FS)
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Definitions of specified parameters SINAD2Ao=6.02 x ENOB + 1.76 dB + 20 log (2A0/FS) The ENOB is expressed in bits.
TSA1203
Analog input bandwidth
The maximum analog input frequency at which the spectral response of a full power signal is reduced by 3 dB. Higher values can be achieved with smaller input levels.
Effective resolution bandwidth (ERB)
The band of input signal frequencies that the ADC is intended to convert without loosing linearity i.e. the maximum analog input frequency at which the SINAD is decreased by 3dB or the ENOB by 1/2 bit.
Pipeline delay
Delay between the initial sample of the analog input and the availability of the corresponding digital data output, on the output bus. Also called data latency. It is expressed as a number of clock cycles.
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TSA1203
Package mechanical data
11
Package mechanical data
In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com.
11.1
TQFP48 package
TQFP48 MECHANICAL DATA
mm. DIM. MIN. A A1 A2 B C D D1 D3 e E E1 E3 L L1 K 0 0.45 0.05 1.35 0.17 0.09 9.00 7.00 5.50 0.50 9.00 7.00 5.50 0.60 1.00 3.5 7 0 0.75 0.018 1.40 0.22 TYP MAX. 1.6 0.15 1.45 0.27 0.20 0.002 0.053 0.007 0.0035 0.354 0.276 0.216 0.020 0.354 0.276 0.216 0.024 0.039 3.5 7 0.030 0.055 0.009 MIN. TYP. MAX. 0.063 0.006 0.057 0.011 0.0079 inch
0110596/C
27/30
Ordering information
TSA1203
12
Ordering information
Part number TSA1203IFT-E TSA1203IF EVAL1203/BA Temperature range -40 C to +85 C -40 C to +85 C Package TQFP48 TQFP48 Evaluation board Packing Tape & reel Tray Marking SA1203I SA1203I
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TSA1203
Revision history
13
Revision history
Date 1-Feb-2003 2-Jan-2006 26-Sep-2006 12-Dec-2006 Revision 1 2 3 4 Initial release. Update of dynamic performance measurements in Table 2 on page 6. Editorial updates. Reorganized document structure. No technical changes. Pin 42 renamed to CLKD. Changes
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TSA1203
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